XTPL is a Company operating in the nanotechnology market segment. We are developing & commercializing globally innovative technology, protected by international patent applications, that enables ultra-precise printing of nanomaterials. Our solution – due to its platform character – will be used in a wide printed electronics sector & provide low-cost, simple, additive manufacturing method for high-tech devices. The technology will facilitate the production of a new generation transparent conductive films (TCF) used in manufacturing of eg. monitors, touch screens, photovoltaic cells & displays – where XTPL can also deliver the technology for open-defects repair and quantum dots deposition. Our solution may also serve as the sought-after alternative for photolithography used, among others, in the semiconductors sector. It has all the features of a ‘disruptive technology’ and will be consistently developed within specific application areas.
The company aims to provide unique printing heads – each time designed & dedicated for specific application field – as well as compatible, precisely adjusted nanoinks. XTPL’s key objective is to develop & implement tailor made solutions in terms of nanoprinting and ultra-precise deposition for several sectors mainly within printed electronics.
THE PROCESS OF COMMERCIALISATION OF XTPL SOLUTIONS is DIVIDED INTO STAGES:
STAGE I (completed) – Development of a lab prototype of the printer (as a proof of concept for patented technology) and a printer-compatible nanoink formula. At this stage, company did not generate any operating revenue; most of its operations were financed from external sources, such as grants, subsidies and funds obtained from the issue of shares.
STAGE II (ongoing) – Business development to build solid pipeline in two areas:
- sales of laboratory printers for research & prototyping segment – product dedicated for R&D centers, both scientific and commercial (potential contractors defined from Asia, North & South America, EU and the Middle East)
- conclusion of JDA type agreements aimed at joined technology development focused on a given application field – commercialization of XTPL technology through designing & construction of dedicated printing head and further industrial implementation in the chosen sectors (potential partners defined from Asia, EU, North America and the Middle East covering the following industries: printed electronics, semiconductors, smart packaging, smart glass & security printing).
The objectives of this stage are primarily: validating the technology and showcasing it to prospective customers, building technological relationships and adapting technological solutions for implementation requirements in specific application areas. At this stage the company expects first revenues.
STAGE III (targeted) – Providing comprehensive solutions for the industry: unique printing heads – each time designed & dedicated for specific application field, as well as compatible, precisely adjusted nanoinks. The company plans for the printing heads – enabling implementation of the revolutionary nanoprinting & ultraprecise depositioning technology – to be designed by XTPL, manufactured by external contractors and assembled finally by XTPL. Nanoinks – basing on patented formulas – will be manufactured by a subcontractor. XTPL will directly sell nanoinks (basing on the production capacity of the business partner) and printing heads, as well as implement the technology for chosen customer’s (technological consulting).
During this stage, the company expects to generate revenues from the sales of dedicated printing heads and nanoinks. XTPL does not exclude also the option of partial licensing of the technology for specific applications in justified cases for partners who will declare readiness for independent industrial development.
XTPL was established in 2015 as a limited liability company. The goal of the founders was to commercialize the breakthrough technology for the production of ultra-thin conductive metallic lines.
In the first period of activity, a laboratory with a unique infrastructure was created, where during five months of intensive research and development, the Company’s team achieved the ability to control the printing process of ultra-thin conductive lines – several dozen times narrower than those available on the market at that time. This technological breakthrough allowed the Company to submit a patent application in March 2016 covering the XTPL printing method and the nanoink formula (application number PCT/EP2017/056739).
On April 25, 2016, a resolution was passed to transform the entity into a joint-stock company (the court approved the transformation on June 1, 2016).
As of 1 September 2016, due to the increase in the scale of operations, the Company transferred the existing research infrastructure to modern laboratories in the Wrocław Research Center EIT + (currently PORT). The apparatus as well as the number of the team have significantly expanded. The Issuer developed the first of its products – a laboratory printer with a compatible nanoink and conducted R&D works aiming at technology development to a level enabling its use in industrial conditions in identified application fields and focused on acquiring partners – potential clients to conclude agreements in the scope joined technology development.
On February 21, 2017, by resolution of the Extraordinary General Meeting number 02/02.2017, a decision was made to split the Company’s shares without decreasing the Company’s share capital by converting the nominal value of the shares to PLN 0.10.
In July 2017, XTPL carried out a public issue of shares, under which 155,000 (one hundred and fifty five thousand) ordinary bearer shares of the M series with a nominal value of PLN 0.10 were acquired. These shares were allocated to 16 persons (physical and legal) in the Institutional Investors Tranche and 349 persons (physical and legal) in the Retail Tranche. Thanks to the conducted issue, the Company raised PLN 10,230,000 gross. The offer included, among others, the German investment fund Acatis through the Universal-Investment GmbH.
On September 14, 2017, the Company’s shares debuted in the Alternative Trading System on the NewConnect market. After the debut, the second large investment fund from Germany Heidelberger Beteiligungsholding AG announced that the threshold of 5% of the total number of votes in the Company was exceeded.
On 16 April 2018, the Extraordinary General Meeting of Shareholders of the Company appointed Mr. Wiesław Rozłucki, the former president and co-founder of the Warsaw Stock Exchange to the Supervisory Board. He was next elected the Chairman of the Supervisory Board of the Company. Currently, he actively supports XTPL in activities related to capital markets and broadly understood corporate governance.
On May 23, 2018, XTPL received an award for one of the most promising technologies among I-Zone participants (the innovation zone) as part of Display Week in Los Angeles – the world’s premier conference industry conferencing industry. Other companies awarded at the event included such giants as Apple, LG Display or Sharp.
In June 2018, XTPL set up an international Advisory Board, the purpose of which is to support the Company in the process of global expansion, among others in the US and Asia. The first member of the Advisory Board was Harold Hughes – former CFO of Intel and CEO of Rambus, veteran of the semiconductor industry and advisor to unicorn companies in the field of electronics.
In July 2018, the Advisory Board was joined by Amir Nayyerhabibi, who for the past three decades built or financed in California a dozen unicorns, specializing in advanced technologies, and gained experience in Intel and Cisco.
In August 2018, the German fund ACATIS decided to invest another EUR 1 million in the Company’s shares. The acquired funds were to finance the business development process in the United States, especially in the Silicon Valley.
In September 2018, Heidelberger Beteiligungsholding AG (a subsidiary of the Deutsche Balaton AG Group) decided to renew the investment in XTPL. The Fund covered a private issue of shares of the Company. The capital raised in the amount of EUR 1.05 million is to be used to further strategically strengthen the process of commercialization of the Company’s solutions in the United States and the development of its patent portfolio.