ESPI Reports
2025
2026
26/2026
First sale of a UPD module to an industrial customer in Japan for the construction of a prototype industrial machine for yield management of advanced printed circuit boards (HDI/UHDI PCB) and substrates in the area of advanced packaging of semiconductors
25/2026
Convening the Annual General Meeting for June 30, 2026
CR ESPI 25/2026 (64 KB)
AGM announcment (195 KB)
Draft resolutions (699 KB)
List of amendments of AOA (190 KB)
Draft consolidated AOA (195 KB)
Management Board proposal coverage of the loss (155 KB)
Report on the activities of the Supervisory Board 2025 (328 KB)
Report on renumeration 2025 (341 KB)
Auditor report regarding the report on remuneration (322 KB)
Power of proxy (85 KB)
Proxy vote form (540 KB)
Information on number of shares and votes (101 KB)
24/2026
Preliminary estimates of revenues from the sale of products and services for Q1 2026
23/2026
Supervisory Board Member resignation
22/2026
Signing of a grant agreement
21/2026
KDPW announcement regarding the registration of the Company’s series Y shares
20/2026
Admission and conditional introduction of the Company’s series Y ordinary bearer shares to trading on the main market of the Warsaw Stock Exchange (GPW)
19/2026
Conditional registration of the Company’s series Y ordinary Bearer shares in the securities depository maintained by KDPW S.A.
18/2026
Registration of the share capital increase and related changes to the Company’s Articles of Association in the Register of Entrepreneurs of the National Court Register (KRS)
17/2026
Summary of the subscription for series Y shares and determination of the share capital
16/2026
Completion of the subscription of Series Y Shares
15/2026
Information, covered by Article 19 MAR, on a transaction made by the CEO
14/2026
Subscription of series Y shares by the Issuer’s CEO Filip Granek, PhD
13/2026
End of bookbuilding as part of the offering of the new series Y bearer shares, and setting the issue price of the series Y shares
12/2026
The Issuer's project is recommended for co-financing by the NCBiR. The project focuses on developing a technological solution for advanced packaging in semiconductors.
11/2026
Commencement of the bookbuilding process in connection with the offering of new Series Y bearer shares
10/2026
First sale of the ODRA system to an industrial client serving the semiconductor sector in the defense and AI industries in the U.S.
9/2026
Resolutions adopted by the Extraordinary General Meeting of XTPL S.A. held on March 9, 2026
8/2026
List of shareholders holding at least 5% of the votes at the Extraordinary General Meeting of XTPL S.A. held on March 9, 2026
7/2026
Execution of a non-exclusive strategic partnership agreement with Manz Asia – entry into a semiconductor innovation center in Taiwan, expansion of the distribution network in Taiwan and India, and sale of the DPS device
6/2026
Notification received pursuant to Article 69 of the Public Offering Act
5/2026
Notification received pursuant to Article 69 of the Public Offering Act
4/2026
3/2026
Intention to raise financing and initiate a share issue process
2/2026
Preliminary estimates of revenues from the sale of products and services for the fourth quarter and 2025
1/2026